| 摘要 |
PURPOSE:To achieve low temperature and low pressure thermocompression bonding conditions and provide a secure and easy bonding operation by a method wherein the aperture of a polyimide sheet is filled with gold for a bump and the gold is bonded to the tip part of a lead by thermocompression bonding and the gold is bonded to a gold bump provided on an integrated circuit by thermocompression bonding. CONSTITUTION:A resin sheet 1 in which an aperture 11, filled with gold 2, is formed at the bonding position, a lead 3 whose tip part is bonded to the top surface of the gold 2 by thermocompression bonding and a gold bump 6 which is formed on an integrated circuit with a thickness of 2-5 mum and bonded to the bottom surface of the gold 2 by thermocompression bonding are provided. For instance, the lead 3 whose tip part is bonded to the gold 2 filling the aperture 11 formed in the polyimide sheet 1 as the resin sheet by thermocompression bonding is bonded to the top surface of a tightly adhering layer 8 composed of a titanium film, a barrier layer 7 composed of a platinum film and the gold bump 6 with a 2-5 mum thickness which are successively built up on an insulating film 9 on the surface of the integrated circuit by thermocompression bonding so as to provide the polyimide sheet 1 between the lead 3 and the edge part 10 of the integrated circuit.
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