| 摘要 |
<p>A tungsten paste suitable for co-sintering with 98+% alumina substrate can be produced by adding selected compositions of glass to the paste. Circuit packages produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish. A preferred embodiment of the invention utilizes a substrate comprising narrow size range alumina powder, thus yielding lower sintering temperature and further improvements in shrinkage variability and surface finish.</p> |
