| 摘要 |
PURPOSE:To reduce the number of times of film removal to simplify the process and work lead terminals with a high accuracy by covering an electrode part on an insulating layer with a organic material film and forming a second insulating layer and grinding it and removing only the organic material film to expose the electrode part. CONSTITUTION:An electrode layer 12 is formed on an insulating layer 11 consisting of an Al2O3 or the like by plating. A dry film 14 is directly coated over the electrode layer 12 without providing a foundation layer between them. The dry film 14 is removed except the part corresponding to the electrode part 12, and the second insulating layer 17 is formed. The second insulating layer 17 is ground until the dry film 14 is exposed, and finally, the film 14 is removed by etching to expose the electrode part 12, thus forming a lead terminal. Therefore, the process is simplified because the number of times of film removal is only two and the foundation layer is not provided, and the lead terminal of high working accuracy is formed.
|
