发明名称 MANUFACTURE OF SPUTTERING TARGET
摘要 PURPOSE:To coincide the constitution of respective components with the composition of a finished target, by compacting a mixture prepared by mixing plural kinds of components into a target shape while applying heat treatment at a temp. in the vicinity of the m.p. of a component having the lowest m.p. among the components and also lower than the m.p. CONSTITUTION:After plural kinds of powdery components are mixed, heat treatment is applied in a pressurized state in order to compact the resulting mixture into a target shape. At this time, treating temp. is regulated to a temp. in a range from (TmX0.70) to Tm deg.C, where Tm means the m.p. of a components having the lowest m.p. among the plural kinds of components. It is preferable that heat treating temp. is regulated to a range from (TmX0.85) to Tm deg.C on order to obtain a sputtering target having high mechanical strength. It is important that this pressure heat treatment is carried out in an inert-gas or reduced- pressure atmosphere to prevent the oxidation of a material.
申请公布号 JPS63128141(A) 申请公布日期 1988.05.31
申请号 JP19860273285 申请日期 1986.11.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KODERA KOICHI;OTA TAKEO;AKIYAMA TETSUYA
分类号 C22C1/04;C23C14/34 主分类号 C22C1/04
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