| 摘要 |
<p>PURPOSE:To enable wafers to be processed within a short time preventing chemical solution from sticking to the back surface not to be processed by a method wherein the chemical solution is fed to chemical solution processing bases surface-processed by a material corrosion-resistant to the chemical solution whereon wafers to be processed are loaded to be processed by chemical solution. CONSTITUTION:Chemical solution processing bases 2 are surface-processed by Teflon corrosion resistant to the chemical solution mixed with nitric acid and fluorine containing water solution applicable to the surface-processing of wafers 1. Said bases 2 are fixed on the four directional ends of a central driving part 8 of the title processor to be turned by a driving motor 8a. Then, the chemical solution 6 is dripped on the central part of bases 2 by a burette 3 while the wafers 1 are lowered on the bases 2 by a loader 5 to spread the chemical solution 6 all over the space between the bases 2 and the wafers 1 for chemical processing of wafers 1. Finally, the processed wafers 1 are discharged from the bases 2 by an unloader 4 simultaneously sucking up the chemical solution 6.</p> |
