| 摘要 |
PURPOSE:To obtain a highly reliable package by a method wherein a resin is put in a metal case and after a substrate mounted with a semiconductor element is pressed to the resin in the case in such a way as to face the element downward and integrally formed with the case, the integral material is turned upside down and in that state, the resin is hardened. CONSTITUTION:A metallic case 8 having one face provided with an aperture is put on a stand 9 in such a way as to face its aperture part upward, a liquid resin 5 is put in the case 8, a substrate 1 mounted with a semiconductor element 2 is pressed to the resin 5 in the case 8 in such a way as to face the semiconductor element 2 downward and the substrate 1 mounted with the semiconductor element 2 is integrally formed with the case 8 with the resin 5 put therein. The obtained integral material is turned upside down and stood in such a way as to face the case upward and in that state, the resin 5 is hardened, the semiconductor element 2 is mounted on the surface of the substrate 1, this semiconductor element 2 is covered with the metallic case 8 having one surface on which an aperture is provided in a state that the element is held at a constant interval between both 2 and 8 and the interval part is sealed with the resin 5. Thereby, a semiconductor package can be obtained.
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