发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To simplify the pressure welding mechanism of a control electrode, by providing a dish-shaped control-electrode-lead supporting spring, which has a function of inserting a control electrode lead wire into a circular recess part and positioning the wire at a specified point and has a function of pressure-welding the control electrode lead wire and the control electrode of a semiconductor element structure under an appropriate load and connecting the wire and the electrode electrically. CONSTITUTION:A control-electrode-lead supporting spring 29 has the following functions: the pressure welding function for supporting a control-electrode-lead compressing part 15 and contacting it to an annular cathode 4 of thyristor element structure 1; and the positioning function for providing the control-electrode compressing part 15 at the specified position of a cathode terminal 10 of a package 6. The control- electrode-lead supporting spring 29 has resiliency and consists of a very thin insulating material whose free height is low. An inserting part 16 of the control-electrode lead wire 14 is inserted into an inserting hole 19 of the control-electrode-lead supporting spring 29 and then into an insulating tube 21. Thus, the number of main constituent parts associated with a control electrode pressure-welding mechanism can be reduced, and the assembly work can be simplified.
申请公布号 JPS63124535(A) 申请公布日期 1988.05.28
申请号 JP19860272142 申请日期 1986.11.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 ITO TAKESHI
分类号 H01L21/52 主分类号 H01L21/52
代理机构 代理人
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