EQUIPMENT FOR AGING SEMICONDUCTOR DEVICE

摘要

PURPOSE:To age semiconductor chips in the stage of a wafer by a method wherein a wafer fitting part is provided in an aging substrate and a signal application means which supplies required signals to the fitted wafer is also provided. CONSTITUTION:At least one wafer fitting part 3a is provided in aging substrate 3 surface. In a semiconductor wafer 6, the input terminals of the respective chips are connected to common lines and common input terminals of the common lines are provided at the end part of the wafer. Various signals are inputted to the common input terminals by a signal application means 7. The wafer 6 is put and fitted in the fitting part 3a in the stage of a wafer and signals transmitted from a controller part 1 are applied to the common input terminals on the wafer through the connector 7 to age all the chips in the wafer 6 simultaneously. Therefore, aging defects can be rejected in the stage of a wafer so that the cost can be reduced.