发明名称 SOLDER PASTE
摘要 PURPOSE:To permit satisfactory soldering with high projection energy and short time by incorporating black powder which does not form a compd. with solder to a solder paste consisting of solder particles, flux and additives. CONSTITUTION:This solder paste 6 is composed of 90% solder particles, 1% carbon as black particles 7 and the balance flux. The black particles 7 transmit the projection energy to the solder particles and the solder paste 6 melts partly when laser light is projected to such paste 6. The paste is melted to a molten pad 5 and is then soldered via solder 5. The projection energy of the laser light, etc. can be increased and the quick satisfactory soldering is executed by using such black particles.
申请公布号 JPS63123593(A) 申请公布日期 1988.05.27
申请号 JP19860269667 申请日期 1986.11.14
申请人 HITACHI LTD 发明人 TANAKA KAZUYUKI;SUZUKI TAKEYUKI;ARAKAWA KENICHI;USAMI KAZUO
分类号 B23K35/22;H05K3/34 主分类号 B23K35/22
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