| 摘要 |
PURPOSE:To contrive to take out wafers without damaging by a method wherein the title device is provided with a wafer cassette to house a plurality of the wafers therein, a mechanism to detect an oblique insertion of wafer and a means to take out and house even obliquely inserted wafers like properly inserted wafers. CONSTITUTION:A finger 8 and arms 9 and 10 perform a taking-out and housing of wafers through the working of an expansion and contraction driving part 21 of pantograph hand. A slant driving part 24 of pantograph hand slants a whole pantograph hand 40 and performs a taking-out of obliquely inserted wafers. A half mirror 27 transmits laser light 33 reflected by a totally reflecting mirror 31 provided at the external end of a wafer cassette 1 and transfers the laser light to a semiconductor laser sensor 29. The semiconductor laser sensor 29 detects this reflected laser light 33. Thereby, the present positions of the wafers 5 can be reliably known and such an erroneous operation as a collision between the finger 8 and the wafers 5 can be prevented. |
