发明名称 |
Flexible film chip carrier with decoupling capacitors. |
摘要 |
<p>An electronic packaging structure (10) includes a second level electronic package (12) having at least one opening (14) formed therein and circuitry (20) for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier (26) includes at least one semiconductor chip (24) mounted on one major surface thereof and at least one decoupling capacitor (34) mounted on an opposite surface thereof. The decoupling capacitor is electrically coupled to input/output contacts of the semiconductor chip. The carrier is then mounted on the second level electronic package so that one semiconductor chip is positioned within a respective opening and the circuitry formed on the carrier is coupled to the circuitry formed on the second level package thereby interconnecting the semiconductor chip to the electronic package.</p> |
申请公布号 |
EP0268260(A1) |
申请公布日期 |
1988.05.25 |
申请号 |
EP19870116952 |
申请日期 |
1987.11.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BLACK, VINCENT JOSEPH;CHARSKY, RONALD STEPHEN;OLSON, LEONARD THEODORE |
分类号 |
H01L23/52;H01L23/538;H01L23/64;H01L25/04;H01L25/18;H05K1/18 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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