发明名称 HIGHLY HEAT-CONDUCTIVE EPOXY RESIN MOLDING MATERIAL
摘要 PURPOSE:To obtain the title material excellent in moldability, abrasion resistance and thermal conductivity, by using alpha-alumina with a specially treated surface layer as a filler. CONSTITUTION:alpha-Alumina is instantaneously fused in a special flame fusing furnace to obtain slightly round specially treated alpha-alumina (B) whose surface layer is has been modified into gamma-alumina. An epoxy resin (A) of, e.g., a bisphenol type is mixed with component B as a filler, an amine, a phenol novolak or the like (C) as a curing agent and, optionally, a cure accelerator, a mold release, or the like (D), and the mixture is kneaded with, e.g., a hot roll at, e.g., 100 deg.C.
申请公布号 JPS63120725(A) 申请公布日期 1988.05.25
申请号 JP19860266593 申请日期 1986.11.11
申请人 SUMITOMO BAKELITE CO LTD 发明人 KUROKI SHINICHI;TANIMOTO SHINICHI
分类号 C01F7/02;C08G59/00;C08G59/18;C08K3/22;C08K9/00;C08L63/00;H01L23/29;H01L23/31 主分类号 C01F7/02
代理机构 代理人
主权项
地址