| 发明名称 |
Surface mountable integrated circuit package equipped with sockets |
| 摘要 |
A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together, the inner surface of the outer ring contains recessed sockets for receiving socket pins upstanding on a circuit board. |
| 申请公布号 |
US4747017(A) |
申请公布日期 |
1988.05.24 |
| 申请号 |
US19860866973 |
申请日期 |
1986.05.27 |
| 申请人 |
GENERAL MOTORS CORPORATION |
发明人 |
KOORS, MARK A.;LUTZ, PHILLIP A. |
| 分类号 |
H01L23/495;H05K3/32;H05K7/10;(IPC1-7):H05K1/14;H05K5/02 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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