| 摘要 |
PURPOSE:To provide the title compsn. which has excellent low-temperature dryness, solderability and adhesion and can form a coating film in a short time, containing an ether compd., a heat-resistant thermoplastic resin soluble in said other compd. and an electrically conductive filler. CONSTITUTION:300-3,500pts.wt. ether compd. (A) having a b.p. of lower than 180 deg.C (e.g., tetrahydrofuran, diethylene glycol dimethyl ether) is blended with 100pts.wt. thermoplastic resin (B) which is soluble in component A, such as an arom. polyamide (a) of formula I [wherein R1, R2, R3 and R4 are each R5, a lower alkoxy or halogen; X is O, S, SO2 or a group of formula II, III, IV or V (wherein R5 and R6 are each H or a lower alkyl); Ar is not less than 70mol% of m-phenylene, not more than 30mol% of p-phenylene, diphenylene ether etc.], an arom. polyether amide imide (b) of formula VI or a polyimide (a) composed of a repeating unit of formula VII (wherein X<-> is a bivalent residue obtd. by removing NH2 groups of an arom. diamine; Y is a tetravalent group obtd. by removing COOH groups of an aliph. or alicyclic tetracarboxylic acid) and 300-3,500pts.wt. electrically conductive filler (C) such as highly electrically conductive metallic powder (e.g., Ag, Cu, Ni, etc.).
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