| 摘要 |
PURPOSE:To bond two or more semiconductor chips to a film carrier, without exchanging a bonding tool, by a method wherein the outer shape of other semiconductor chips is unified to the outer shape of a semiconductor chip with the biggest outer shape and the semiconductor chips are heated and pressed by means of the bonding tool whose tool face is shaped to have almost the same outer shape as that of the semiconductor chips. CONSTITUTION:The outer shape of semiconductor chips 3a, 3b is unified to the outer shape of a semiconductor chip 3c with the biggest outer shape among the semiconductor chips 3a-3c; an electrode pad 9 is arranged at the marginal parts of the semiconductor chips 3a-3c. A tool face 21 of a bonding tool 17 is shaped to have almost the same outer shape as that of the chips 3a-3c. After an opening 5 of a film carrier 1 has been aligned with the chips 3a-3c, the bonding tool 17 is lowered; by means of only one bonding tool 17, it is possible to bond all the chips 3a-3c, to be used for one portable medium, to the film carrier 1. Because the position of the electrode pad 9 on the chips 3 is unified in relation to the tool face 21, it is not required to change the temperature setting of a heater 19 in consideration of the temperature difference on the tool face 21.
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