发明名称 SURFACE POLISHING DEVICE
摘要 PURPOSE:To sustain the flatness with a high degree of accuracy, by filling polishing liquid in a liquid tank to such a degree that a stool and a pressurizing plate are sunk into polishing liquid during the workpiece is polished, so as to prevent the temperatures of a stool and a pressurizing plate from rising and to prevent occurrence of the difference in pressure between the upper and lower surfaces. CONSTITUTION:A drive source 12 rotates a liquid tank 11 together with a stool 13 in the liquid tank 11. In this condition, a pressurizing plate 22 is lowered so that a workpiece 23 bonded to the lower surface of the pressurizing plate 22 is made into press-contact with the upper surface of the stool 13 on rotation under a predetermined pressure in order to polish the workpiece 23 by the stool 13. Meanwhlie, polishing liquid 14 is circulated from the liquid tank 11 by means of a pump 18 through a suction pipe 16, a temperature managing device 15 and a supply pipe 17 to cool the stool 13 and the workpiece by the polishing liquid 14 so as to prevent a temperature rise of the stool 13 and the transmission of heat to the pressurizing plate 22. As a result the polishing liquid whose temperature is raised, is cooled while it circulates through the temperature managing device 15, thereby it is possible to maintain the liquid at a set temperature.
申请公布号 JPS63114872(A) 申请公布日期 1988.05.19
申请号 JP19860257895 申请日期 1986.10.29
申请人 SPEEDFAM CO LTD 发明人 SUGIYAMA MISUO
分类号 B24B37/00;B24B37/015;B24B57/00 主分类号 B24B37/00
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