| 摘要 |
<p>A fusible link comprises a semiconductor substrate (11), an electrically insulating layer (13) on the substrate, a pair of conductor elements on the surface of the insulating layer opposite the substrate, and a fuse conductor layer (29) on the surface of the insulating layer opposite the substrate electrically connecting the conductor elements. A cavity is formed in the insulating layer and the substrate adjacent the fuse conductor layer. The cavity has a configuration to provide a substantial reduction in the thermal conductivity cross-section between the fuse conductor layer and the substrate. Such substantial reduction is selected to enable a predetermined electrical power input to the fuse conductor layer to generate an open circuit in the layer. In a preferred form, the cavity has a configuration to form a bridge comprised of the fuse conductor layer and the portion of the insulating layer upon which the fuse conductor layer is disposed.</p> |
