| 摘要 |
PURPOSE:To improve humidity resistance by shaping two or more grooves or protrusions at the part where a lead part is molded in such a way that they cross a direction extended from the lead part. CONSTITUTION:Two or more grooves 9 are formed at a stepped part to be molded at a lead part 3a in such a way that they cross a direction extended from the lead part 3a and that they are located on the same side as a semiconductor chip on a die pad part 2. By the function of the grooves 9 which are formed at the stepped part of the lead part 3a, the adhesive strength is improved remarkably in addition to the ordinary adhesive strength between the stepped part and molded resin 4 because the interlocking with the molded resin 4 due to the unevenness of the grooves 9 is added. Even when vapor penetrates from the outside through the part where the lead part 3a projects from the molded resin 4, it is possible to prevent the vapor from penetrating at the stepped part thanks to the strong adhesive strength. By this effect, the semiconductor chip is hardly deteriorated or broken. |
