| 摘要 |
<p>PURPOSE:To increase the heat resistance of a chip and avoid the discontinuity of an aluminum wire and the breakdown of an insulating layer and improve the reliability of the operation of a semiconductor device by a method wherein a holder through which external electrode terminals connected to a semiconductor chip are inserted and held is provided in one piece with a box whose inside is filled with resin sealing the semiconductor chip and a cover which closes the box tightly is fitted around the holder. CONSTITUTION:A cylindrical box 11 with a bottom is composed of a rectangular insulating board 12 and a square case 13 and its inside is filled with silicone gel 8 which seals a semiconductor chip 3. A holder 14 through which a DC output terminal 6 and three-phase input terminals 7 which are connected to the semiconductor chip 3 are inserted and held is provided in one piece with the case 13 of the box 11. A cover 15 which closes the box 11 tightly is provided on the case 13 and fitted around the holder 14. In a semiconductor device constituted like this, an air gap which absorbs the expansion of the silicone gel 8 can be formed between the case 13 filled with the silicone gel 8 and the cover 15.</p> |
