发明名称 WIRING SUBSTRATE AND MANUFACTURE THEREOF
摘要 PURPOSE:To prevent the penetration of the moisture into a hermetically sealed region and to execute a highly reliable and high-speed operation by forming a ring-shaped insulator layer composed of crystallized glass in such a way that the layer surrounds the central part at a prescribed face on a ceramic substrate. CONSTITUTION:An input/output conductor pad 6 and a comparatively short conductor pattern 7 extended from the pad are formed by a thick film method at the circumference of a ceramic substrate 5; a ring-shaped insulator layer 8 whose width is sufficient to expose both ends of the thick film conductor pattern 7 is formed while a crystallized glass paste is printed, dried and baked; a conductor pattern 9 whose width is narrower than the insulating layer 8 is formed on the layer 8 by the thick film method. Then, at the inside of the thick film conductor pattern 9, a thin film conductor pattern 10 whose main conductor is copper and a ployimide layer 11 whose thickness is about the same as that of the pattern 10 are laminated alternately by a thin film method. In addition, a die pad 14 for mounting an active element and a passive element and an outer-lead bonding pad 15 are formed at a thin film conductor part at the uppermost layer. Then, a metal cap 19 is fixed to the thin film conductor pattern 9.
申请公布号 JPS63110755(A) 申请公布日期 1988.05.16
申请号 JP19860257971 申请日期 1986.10.29
申请人 TOSHIBA CORP 发明人 FUKUOKA YOSHITAKA
分类号 H01L23/02 主分类号 H01L23/02
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