SUBSTRATE CONDITIONING METHOD FOR ELECTROLESS PLATING,申请号JP19870205331-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	SUBSTRATE CONDITIONING METHOD FOR ELECTROLESS PLATING
摘要
申请公布号	JPS63111180(A)	申请公布日期	1988.05.16
申请号	JP19870205331	申请日期	1987.08.20
申请人	INTERNATL BUSINESS MACH CORP <IBM>	发明人	SURIYADEBARA BUIJIYAKUMAA BABU;NIIN SUINGU RUU;GERARUDO WARUTAA JIYOONZU
分类号	C23C18/20;C23C18/22;C23C18/30;H05K3/18;H05K3/38	主分类号	C23C18/20
代理机构		代理人
主权项
地址

您可能感兴趣的专利

IMAGE FORMING APPARATUS

DISTANCE MEASURING DEVICE

DISPLAY APPARATUS

LIQUID CRYSTAL DISPLAY SYSTEM AND PIXEL-CHARGE DELAY CIRCUIT THEREOF

MODIFIED WAGERING GAME SYSTEMS AND METHODS

Interconnect Structure for Semiconductor Devices

LATERAL CONNECTION FOR A VIA-LESS THIN FILM RESISTOR

NITRIDE SEMICONDUCTOR LIGHT EMMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

FORKLIFT WITH ANTI-VIBRATION MECHANISM

VEHICLE EQUIPMENT FOR A MOBILE APPLIANCE

SYSTEM AND METHOD FOR ASSISTING DRIVER WHEN REVERSING MOTOR VEHICLE

BATTERY CAPACITY TEST APPARATUS

BIOLUX LIGHTING APPARATUS

Tactile Switch and Method for Manufacturing Tactile Switch

Looped wire elastomeric contactor

SHOE HAVING AN ACTIVE VENTILATION MECHANISM

TURBINE NOZZLE BIFORM REPAIR

COMBINATION PRESSURE THERAPY FOR TREATMENT OF SERUM LIPID LEVELS, STEROID LEVELS, AND STEROIDOGENESIS

AUTOMATIC ANALYSIS APPARATUS