| 摘要 |
PURPOSE:To conduct filling sufficiently by forming a hole near the center, where a semiconductor element is positioned, in a substrate and injecting a resin. CONSTITUTION:A hole 5 is shaped near the center of an element mounting- position in a semiconductor-element mounting substrate 2, and a resin 4 is injected into a fine clearance between a semiconductor element 1 and the substrate 2 from the hole 5. Since the semiconductor element 1 is sealed from upper and lower sections together with the resin 4 from the rear of the element, filling is performed sufficiently, thus improving the reliability of sealing.
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