| 摘要 |
PURPOSE:To form a dense uniform film on the surface of a copper-base metal by chemical conversion treatment with a soln. contg. phosphate ions, metal ions, halogen ions and an oxidizing agent by previously sticking colloidal particles to the surface of the metal. CONSTITUTION:A soln. of 0.5-3.5pH for chemical conversion treatment contg. phosphate ions, metal ions which are present in the aq. soln. as a stable dihydrogenphosphate compd. in combination with the phosphate ions and undergo reduction in solubility by a dehydrogenation reaction, e.g. Zn or Mn ions, ions of halogen other than fluorine and an oxidizing agent which accelerates the dissolution of copper in the acidic soln. is prepd. When the soln. having >=400mV oxidation-reduction potential is brought into contact with the surface of a copper-base metal to form a film by chemical conversion treatment, a soln. contg. dispersed colloidal particles of an inorg. compd. such as a Ti compd. is previously brought into contact with the surface of the metal to stick the colloidal particles to the surface. Thus, a dense uniform film is formed by chemical conversion treatment by about 0.5-5g/m<2> and the adhesion of the film to copper is improved.
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