| 摘要 |
PURPOSE:To secure the thickness of a solder by forming the metal film having an affinity with solder on the surface of the treating member of an Al, etc., manufacturing a linear groove by surrounding a soldering part and then depositing the solder. CONSTITUTION:The metal film 2 of Ni, etc. having the affinity with a solder is formed on the surface of the treating member 1 of Al or Al group alloy. A marking-off process is then performed to form the linear groove 3 that the base metal surface 1a is exposed on the metal film 2 and the soldering part 2 is surrounded by the base metal surface 1a of the treating member 1. In succession, the molten solder is brought into contact with a soldering part 20 and the solder is deposited without using any flux. Due to the groove 3 being formed the flow-out of the molten solder to the external part from the soldering part 20 by exceeding the base metal surface can be prevented. Consequently the thickness in soldering can be secured.
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