| 摘要 |
PURPOSE:To prevent adherence of chemical solution onto the top face of a wafer, by supplying the chemical solution onto a support, and disposing the wafer surface to be treated on the chemical solution so as to diffuse the solution all over the surface of the wafer by the action of surface tension. CONSTITUTION:A corrosion-resistive support 1 is disposed horizontally and surface treating solution 2 is supplied onto the support. The solution is used in a minimum amount required to treat the area of a wafer to be treated in the state of surface tension. The chemical solution 2 is crushed by the wafer 3 and diffused over the underside face of the wafer 3, whereby all the wafer surface to be treated is contacted with the solution. The wafer is then slided on the support and discharged. If the amount of the solution is proper, no solution is stored ahead of the wafer slided on the support, creeps over and adheres on the top face thereof. Thus, the yield of chips can be improved.
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