DISSOLUTION OF METALS UTILIZING TUNGSTEN-DIOL COMBINATIONS

摘要

DISSOLUTION OF METALS UTILIZING TUNGSTEN-DIOL COMBINATIONS Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and combinations of catalytic amounts of tungsten and of certain diols. The present invention relates to the dissolution of metals in an aqueous bath containing sulfuric acid and hydrogen peroxide, and in particular to a novel bath composition capable of effecting the dissolution at high rates. In one specific aspect the invention is concerned with etching of copper in the production of printed circuit boards.