| 摘要 |
PURPOSE:To obtain an apparatus which can simply meet change of chip size and supplies chips without giving any damage by electrically detecting displacement using a detector and compensating such displacement with a chuck. CONSTITUTION:The accommodating condition detecting result of chip 7 accommodated in the pocket 41 of supply location by the X-Y stage 4 is indicated on the X-Y-Z stage 6 by a detector installed at the vertically elevated upper area. In accordance with such indication, the chuck 61 is first shifted both in X and Y directions by motors 67 and 68 so that the centers of chip 7 and chuck 8 align. Next, the motor 62 operates in accordance with a displaced rotating angle of chip 7, rotating the chuck 61 with link mechanism 63 and chuck rotating bar 64 until it is aligned with the displaced chip. The chuck 61 holding the chip 7 is lifted by the motor 69 and is transferred to the package 8 through a movable arm by the motor 68. After the chuck is returned to the stored optimum position, it is moved downward by the motor 69, resetting a holding mechanism 65. Thereby, the chip 7 is accurately mounted on the package 8 through alignment of the center. |
