| 摘要 |
PURPOSE:To obtain a highly reliable resin sealed electronic devices, by using a polyphenylene sulfide (PPS) resin which is washed with hot water at 150 deg.C or higher. CONSTITUTION:An inorganic filler such as dissolved silica is compounded in PPS. Silane and Ti coupling agents are compounded, as required and adhesion of the resin and the part is increased. At first, water having electric conductivity of 0.5muS/cm or less is used, and desirably hot water of 170 deg.C is obtained. The granule of PPS is washed with the hot water. A bath ratio of 200g of PPS with respect to 1l of the water is used, and the materials are heated, stirred and washed in a pressure container. The chemical denaturation of the end of the PPS, which has electrolyte component that can undergo hydrolysis, is carried out efficiently in an O2 atmosphere. The water-soluble electrolytic component, which is present as a form of salt in the PPS, is physically removed efficiently. Washing with the hot water is performed several times. The PPS washed in this way and a filler are subjected to dry mixing and molding. Thus resin sealed devices excellent especially in moisture resistance and reliability are obtained. |
