发明名称 INNRETNING FOR UNDERSTOETTELSE AV METALLISK MIKROFILTERFOLIE.
摘要 A supporting structure consisting of two layers (a, b) is applied by electroplating to the back of the microfilter foil (3). The first, lower layer (b) consists of a number of columnar projections (5) which widen at their upper ends to form mushroom-shaped caps (4) which corrode together to form an extended second layer which leaves open macropores (6) free. As compared with the micropores of the microfilter foil, the coherent supporting structure has large pores and considerable stability. <IMAGE>
申请公布号 NO874410(A) 申请公布日期 1988.04.25
申请号 NO19870004410 申请日期 1987.10.22
申请人 SULZER BROTHERS LTD 发明人 EHRSAM, CHRISTIAN
分类号 B01D61/18;B01D29/01;B01D29/11;B01D29/94;B01D63/00;B01D65/00;B01D67/00;B01D69/10;B01D71/02;C25D1/08;(IPC1-7):B01D/ 主分类号 B01D61/18
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