| 摘要 |
PURPOSE:To perform removal and bonding to and from a material to be machined at an atomic unit, by applying a voltage across the material to be machined and a metal probe, controlling the position of the metal probe, moving the tip part of the metal probe, and machining the material to be machined. CONSTITUTION:This apparatus is provided with the following parts : a metal probe 2, which can be moved in the non-contact state with a material to be machined 1, a power source 3, which applies a voltage across the material to be machined 1 and the metal probe 2; a control circuit 6, which controls the position of the metal probe 2 with the value of a current flowing between the material to be machined 1 and the metal probe 2; a driving mechanism, which moves the tip part of the metal probe with the signal from the control circuit 5; and a projecting means, which projects any of a laser beam, an electron beam or an ion beam onto the machining area of the material to be machined. Thus the material to be machined is machined. A tunnel current can be made to flow in a concentrated manner to an atomic unit in the material 1 from the tip of the metal probe 2. With the current effect, the atom can be electrically excited and chemically activated. The bonding strength with surrounding atoms can be physically weakened. Thus the atom can be selectively stripped off the material 1 or bonded to the other atom. |
