发明名称 CHIP FEEDING METHOD
摘要 PURPOSE:To ensure the separation even if a gap between chips is narrow and to make it possible to perform stable feeding, by deteriorating a bonding agent, which holds the chips on a supporting sheet, with a light beam or a thermal beam, and separating the chips from the supporting sheet. CONSTITUTION:A bonding agent, which holds chips 1 on a supporting sheet 2, is deteriorated with a light beam or a thermal beam, and the chips 1 are separated from the supporting sheet 2. It is not necessary to break the supporting sheet 2 in order to separate the chips 1. The chips can be separated without skipping the neighboring chip 1 even if a gap between the chips 1 is small. Since the attitude of the chip 1 is stabilized in separation even if the chip is minute, stable feeding is possible. Holes are not present in the supporting sheet 2. The sheet 2 is not slackened. Tension does not become unstable in this sheet. The positions of the chips 1 are stable. Therefore, the chips 1 can be supplied stably.
申请公布号 JPS6392038(A) 申请公布日期 1988.04.22
申请号 JP19860237351 申请日期 1986.10.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAMOTO AKIHIRO;MAKINO YUTAKA;INAGAKI NORIYUKI;MATSUMURA SHINYA
分类号 H01L21/52;H01L21/67;H01L21/68 主分类号 H01L21/52
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