发明名称 Process for mounting electronic components on a printed circuit board.
摘要 <p>The process consists in positioning on the printed-circuit board (34) two symmetrical combs (10-12) having tines (14-16) which are uniformly spaced, straight, parallel to each other and with an inclination corresponding to the diagonals of the grid of the plated-through holes (32), the edges (18-20, 24-26) of the said tines being bevelled so that two superimposed combs (10-12) define on the printed-circuit board around the plated-through holes guiding feeds in the form of lozenges facilitating the insertion of the free ends of the terminals (36) into the holes (32) of the printed-circuit board (34), in making the free ends of the terminals (36) penetrate into the plated-through holes (32), then in detaching the combs (14-12) and causing them to slide parallel to the direction of their respective tines and finally in completing the insertion of the component (C) into the holes (34) so that it is ready for subsequent operations. &lt;IMAGE&gt;</p>
申请公布号 EP0264322(A1) 申请公布日期 1988.04.20
申请号 EP19870402198 申请日期 1987.10.05
申请人 SOCAPEX 发明人 COTTET, JACQUES FRANCOIS;SERVOZ, SERGE PHILIPPE
分类号 H01R43/20;H05K3/30;H05K13/04;(IPC1-7):H05K13/04 主分类号 H01R43/20
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