首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
MANUFACTURE OF IC CHIP WITH BUMP AND WAFER FOR MANUFACTURE THEREOF
摘要
申请公布号
JPS6386458(A)
申请公布日期
1988.04.16
申请号
JP19860230090
申请日期
1986.09.30
申请人
TOSHIBA CORP
发明人
IBA YUICHIRO
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Aluminum foil
Means for increasing the endurance limit of highly stressed structural parts, especially of crank shafts for motor vehicles
Method and composition for forming container closures and products so produced
Improvements relating to curable chlorinated polyethylene compositions and their use
Polyurethane elastomer compositions and process for producing the same
Frostable phenol-aldehyde resins
Production of vinyl chloride
Induction furnace
Oxidation of 3-hydroxy-17-alkynyl-steroids
Method of coating metal articles electrolytically
English/metric read-off or indicator means for machine tools and the like
Improvements in or relating to a tractor-mountable loader
Improvements in or relating to vehicle driving means
Improvements in or relating to controls for maintaining a web in a predetermined line of travel
Method of producing a crown or like metal cap, crown caps and container closures similar thereto
Improvements in or relating to transcription arm and pivot assemblies for phonograph record reproducers
A semiconductive circuit arrangement
Process for the preparation of granular or crystallised products
Process for producing a covering material
A magnetic machine or coupling