| 摘要 |
PURPOSE:To enable injecting a developer uniformly on a semiconductor wafer without providing a plurality of developer feed outlets by providing at least two or more injection outlets at the tip of a nozzle attached at the end of the developer feed outlet. CONSTITUTION:An injection surface 4 is divided into a larger and a smaller injection surfaces 4, 4 by a groove 12 perpendicular to a raised part 2 and on each injection surface 4, notched grooves 5, 5 and injection outlets 6, 6 are alternately formed respectively. A semiconductor wafer 8 is attracted and fixed on a metal plate 10 and is rotated and a developer 9 is injected from the injection outlet 6 in the larger injection surface 4 to a wider range and from the outlet 6 in the smaller injection surface 4 to a narrower range. Accordingly, the developer can be injected in different injection states with the two injection outlets 6, 6 and the developer can be injected uniformly on the semiconductor wafer 8 without providing a plurality of developer feed outlets 7. |
