| 摘要 |
PURPOSE:To eliminate the reduction in reliability due to crack and so on as well to contrive the improvement of moisture resistance by a method wherein a semiconductor integrated circuit device and metal materials for supporting this are coated with a flexible and sticky molding material and moreover, the outside thereof is coated with a hard molding material. CONSTITUTION:A flexible and sticky molding film 4 is directly coated on a semiconductor integrated circuit device 2, metal materials 3 and bonding wires 5. The outside of this flexible and sticky molding film 4 is coated with a hard molding material 1. In a semiconductor device constituted in such a way, even though this semiconductor integrated circuit device 2 and the metal materials 3 are expanded by heat, the flexible and sticky molding material 4 is deformed in such a way as to absorb the deformation to be generated by this and the stress to be generated between these and the hard molding material 1 can be absorbed. Moreover here, as the metal wires 5 are also coated with the flexible and sticky molding material, the cutting of the metal wires 5 can be prevented. Moreover in this case, adhesion with the hard molding material and adhesion with the semiconductor integrated circuit device, the metal materials and so on are enhanced by a combination of molding materials which are different in softness from each other and the moisture resistance and so on can be further improved. |
