Method of making microwave integrated circuits

摘要

A method of making a multiplicity of microwave integrated circuits is disclosed wherein a thin glass substrate is etched to contain both via holes and large area holes which receive discrete active devices therein. An electrically and thermally conductive carrier is adhered to one surface of the glass substrate with the electrical interconnections and circuit components formed on the opposing surface of the glass substrate. The method enables a multiplicity of microwave circuits to be made and tested by batch processing techniques prior to division into individual circuits.