发明名称 ELECTROLESS PLATING BATH
摘要 PURPOSE:To obtain an electroless plating soln. for forming a magnetic thin film having superior corrosion resistance by dissolving Co ions, molybdate ions, a reducing agent for those ions and gluconic acid groups as a complexing agent for those ions in water. CONSTITUTION:An aq. soln. contg. a soluble salt of Co such as sulfate, chloride or acetate by 0.004-1mol/l (expressed in terms of Co ions) and a soluble salt of molybdic acid such as Na, K or ammonium salt by 0.00001-0.3mol/l (expressed in terms of Mo ions) is prepd., 0.01-0.9mol/l one or more kinds of compds. such as hypophosphites and hydrazine as a reducing agent for the metal ions are added to the aq. soln. and 0.001-3mol/l formic acid, auetic acid or the like is further added so that the soln. contains 0.00001-1.5mol/l gluconic acid groups as a complexing agent for the metal ions. electroless plating is carried out with the resulting electroless plating soln. to form a magnetic thin film having superior corrosion resistance and magnetic characteristics on a metallic substrate or an activated nonmetallic substrate.
申请公布号 JPS6379977(A) 申请公布日期 1988.04.09
申请号 JP19860225407 申请日期 1986.09.22
申请人 NEC CORP 发明人 GOTO FUMIO;YAMAMOTO TAKEHIKO
分类号 C23C18/50;C23C18/52;G11B5/858 主分类号 C23C18/50
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