发明名称 |
Method for fitting integrated circuits onto a substrate consisting of insulating material |
摘要 |
In order to fit integrated circuits onto a substrate which is provided with conductor tracks, and to make contact with said integrated circuits, it is proposed additionally to fit a flexible supply lead and then to connect the connecting tabs of the integrated circuits electrically and mechanically to the conductor tracks of the substrate by means of pressure and a non-conductive adhesive, and to connect them to the conductor tracks of the supply cable by soldering.
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申请公布号 |
DE3633565(A1) |
申请公布日期 |
1988.04.07 |
申请号 |
DE19863633565 |
申请日期 |
1986.10.02 |
申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
BADER,OTTO,DIPL.-PHYS.;WIEMER,WOLFRAM,DR.RER.NAT. |
分类号 |
G09F9/30;H05K1/00;H05K3/30;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):H05K3/30 |
主分类号 |
G09F9/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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