发明名称 Method for fitting integrated circuits onto a substrate consisting of insulating material
摘要 In order to fit integrated circuits onto a substrate which is provided with conductor tracks, and to make contact with said integrated circuits, it is proposed additionally to fit a flexible supply lead and then to connect the connecting tabs of the integrated circuits electrically and mechanically to the conductor tracks of the substrate by means of pressure and a non-conductive adhesive, and to connect them to the conductor tracks of the supply cable by soldering.
申请公布号 DE3633565(A1) 申请公布日期 1988.04.07
申请号 DE19863633565 申请日期 1986.10.02
申请人 LICENTIA PATENT-VERWALTUNGS-GMBH 发明人 BADER,OTTO,DIPL.-PHYS.;WIEMER,WOLFRAM,DR.RER.NAT.
分类号 G09F9/30;H05K1/00;H05K3/30;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):H05K3/30 主分类号 G09F9/30
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