发明名称 MULTILAYER SUBSTRATE
摘要 PURPOSE:To manufacture a multilayer substrate having no void by forming gas vent holes at positions not used as a product of the substrate, thereby to smoothly vent gas. CONSTITUTION:In a manufacturing method for a multilayer substrate by laminating multilayer substrates 1, 1', prepregs 2, 2' and an inner layer substrate 3 and thermally pressing them, gas vent holes 5 are formed at the position not used finally as a product. Gas generated by heating forms voids 4, which are pushed to the end face of a material and gas vent holes 5. Since the holes 5 are formed, distances from voids to the end face of the material and the holes 5 are shortened to smoothly remove the voids 4.
申请公布号 JPS6377730(A) 申请公布日期 1988.04.07
申请号 JP19860221804 申请日期 1986.09.22
申请人 HITACHI LTD 发明人 HAMA TAKEHIKO
分类号 B32B5/28;B29C43/20;B29C65/52;B29C65/70;B29L9/00;H05K3/46 主分类号 B32B5/28
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