| 摘要 |
PURPOSE:To improve the workability of soldering, by a method wherein an alloy layer consisting of Ni and Cu is formed to a terminal part or a pad part to be soldered and a layer to prevent soldering from spreading is formed in a dam state to the peripheral part of said soldering position. CONSTITUTION:A wetting area in soldering is controlled by forming a specific shaped dam consisting of heat resisting resin 7 or oxides and nitrides 8 of inorganic-type to the soldering peripheral part of the terminal or pad part for which Ni-Cu alloy material is used, and the simultaneous operations of many soldering joints can also be smoothly executed. Further, its corrosion resistance is improved by Ni-Cu alloy layer and the joint is instantly wetted by using flux in soldering. Besides, since the diffusion speed of 63 Sn/37 Pb solder 4 is about one hundredth of Cu simple substance, and the necessary thickness as a Ni-Cu alloy electrode in execution of solder joint is may be safely settled to be a fraction of that of Cu electrode, accordingly the time to form a film can be extremely shortened. Further, the following photoetching can be processed in a short time and the precision of a pattern is improved. |
