| 摘要 |
PURPOSE:To increase the number of semiconductor pellets formed on a wafer and to improve yield, by forming TEG parts in the vicinity of corner parts on circuit forming regions for the semiconductor pellets mounted on a semiconductor device. CONSTITUTION:Prescribed circuit regions 8 are formed on a surface of a wafer 7, obtained by slicing single-crystal ingot of silicon, through several processes such as oxidation, diffusion, and evaporation, and furthermore the wafer 7 is divided every unit of these circuit regions 8, so that semiconductor pellets 3 are obtained. The prescribed circuit regions 8 and aluminium pads 9 are formed on the surface of the semiconductor pellets, and besides TEG parts 10 are formed on four corners of each pellet. The TEG parts, conventionally formed on the side parts of the semiconductor pellets 3, are formed in the vicinity of the corner parts, and consequently the circuit forming regions 8 of respective semiconductor pellets 3 can be formed adjacent to each other. Therefore, the number of semiconductor pellets 3 formed on the wafer 7 can be increased and so the yield for the wafer 7 can be improved. |
