| 摘要 |
PURPOSE:To realize the complete automation by a method wherein each processing chamber, cut off from the outside atmosphere, is connected by transfer mechanisms, cut off from the outside atmosphere, and the working process in each processing chamber is controlled by a computer. CONSTITUTION:A wafer is supplied to a wafer supplying chamber 10, cut off from the outside atmosphere, and measured and tested automatically by a measuring mechanism 12 according to instructions from a terminal 11 of a host computer CPU02. The wafer of no defect is transferred to a processing chamber 20, cut off from the outside atmosphere, at the center by a wafer transfer mechanism 04, also cut off from the outside atmosphere. The wafer in the processing chamber 20 is transferred to an oxidization processing chamber 30, cut off from the outside atmosphere, and oxidized while being measured by a measuring mechanism 32 which receives instructions from a terminal 31 of CPU02. The oxidized wafer is transferred to the processing chamber 20 again by the transfer mechanism 04. By repeating similar procedure, the complete automation can be realized. |
