发明名称 WIRE BONDING PROCESS
摘要 PURPOSE:To improve the yield of wire bonding process as well as the reliability upon quality markedly by a method wherein the sides of a stem post is provided with a notch so that the notch may be located in an identification region of a monitor display to perform the wire-bonding process constantly on a specified position of the post. CONSTITUTION:A pellet 10 on the laser side and a post 10 on the lead side are to be wire bonded. At this time, any positional slip of pellet 10 is corrected as usual so that the pellet 10 may be wire-bonded onto an arbitrary position. In order to correct any deformation and displacement of the post 11, the side of post 11 is provided with a notch 13 so that the notch 13 may be located in an identification region 15 of a monitor display 14 to perform the wire bonding process onto a specified position, i. e., a bonding point 16. Resultantly, even the post with a bent part or an extremely narrow bonding surface can be bonded constantly onto the stable position.
申请公布号 JPS6370533(A) 申请公布日期 1988.03.30
申请号 JP19860216213 申请日期 1986.09.12
申请人 SHARP CORP 发明人 NOZAKI KENZO;YAO KAZUYUKI
分类号 H01L21/60 主分类号 H01L21/60
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