发明名称 HIGH-BREAKDOWN-STRENGTH POLYCRYSTALLINE SILICON THIN FILM TRANSISTOR
摘要 PURPOSE:To provide a high breakdown strength between a source and a drain and to simultaneously obtain high mutual conductance in a polycrystalline silicon thin film transistor by providing offset gate regions between a gate and a source, and between the gate and a drain, and setting the impurity concentrations of the offset gate regions to a specific range. CONSTITUTION:Offset gate regions 8 are provided between a gate 4 and a source 5 and between the gate 4 and a drain 6 of a polycrystalline silicon thin film transistor in which a polycrystalline silicon thin film 2 is used as a channel region. The impurity concentrations of the regions 8 are set to 8 X 10<16> cm<-3> or higher and smaller than the impurity concentration of the regions 5, 6. For instance, P is implanted by an ion implanting method 1.5 X 10<17> cm<-3> to the offset gate region of the film 2 on a quartz substrate 1 and heat treated at 900 deg.C in a nitrogen atmosphere to be activated. Thereafter, in order to form the regions 5, 6, As is added 10<20> cm<-3> by an ion implanting method and heat treated at 900 deg.C in a nitrogen atmosphere to be activated.
申请公布号 JPS6366969(A) 申请公布日期 1988.03.25
申请号 JP19860209691 申请日期 1986.09.08
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 SEKI SHUNJI;KOGURE OSAMU
分类号 H01L27/12;H01L21/336;H01L29/78;H01L29/786 主分类号 H01L27/12
代理机构 代理人
主权项
地址