发明名称 Heat resisting low expansion zirconyl phosphate-zircon composite bodies and process for producing the same.
摘要 <p>Heat resisting low expansion zirconyl phosphate-zircon composite bodies are disclosed, which contain zirconyl phosphate and zircon as a main crystalline phase and a secondary crystalline phase, respectively. The heat resisting low expansion zirconyl phosphate-zircon composite bodies have a coefficient of thermal expansion in a temperature range from room temperature to 1,400 DEG C being not more than 30x10&lt;-&gt;&lt;7&gt;/ DEG C and a melting point being not less than 1,600 DEG C. The composite bodies have a chemical composition essentially consisting of 58.2 to 65.4% by weight of ZrO2, 17.4 to 37.1% by weight of P2O5, and 1.5 to 19.0% by weight of SiO2. The heat resisting low expansion zirconyl phosphate-zircon composite bodies optionally contain MgO and A l 2O3 in a total amount of not more than 2.5% by weight or 0.1 to 4% by weight of Nb2O5. A process for producing such zirconyl phosphate-zircon composite bodies is also disclosed.</p>
申请公布号 EP0260893(A2) 申请公布日期 1988.03.23
申请号 EP19870308063 申请日期 1987.09.11
申请人 NGK INSULATORS, LTD. 发明人 WATANABE, KEIICHIRO 4E CO.NAKANOMACHI HOUSE;OHASHI, TSUNEAKI NGK TAKEMI-RYO
分类号 C04B35/447;C04B35/48 主分类号 C04B35/447
代理机构 代理人
主权项
地址
您可能感兴趣的专利