发明名称 RADIAL LINE SLOT ANTENNA STRUCTURE IN PLASMA SURFACE TREATMENT DEVICE FOR SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To uniformize surface treatment by preventing distortion deformation due to thermal expansion in a slot plate, arranged at the lower face side of a dielectric plate in the antenna guide of a radial line slot antenna, in which plasma by microwaves is generated with the surface of a semiconductor substrate when conducting the surface treatment of the semiconductor substrate. SOLUTION: The inside part of at least the mounting part of a slot plate 7 on an antenna guide 2 is provided with an expansion absorbing part 11, constituted by perforating a through-hole 11b, so that a deformable fine width piece 11a for connecting the further outside part with the inside part can be left so that the expansion absorbing part 11 can be circularly extended along the whole periphery. Thus, thermal expansion at the inside part is prevented from exerting influence on the outside part.
申请公布号 JP2000286240(A) 申请公布日期 2000.10.13
申请号 JP19990089285 申请日期 1999.03.30
申请人 ROHM CO LTD 发明人 MURAKAWA EISUKE;TANAKA KENJI
分类号 H01L21/302;C23C16/50;C23C16/511;C23F4/00;H01L21/205;H01L21/3065;H01L21/31;(IPC1-7):H01L21/306 主分类号 H01L21/302
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