| 摘要 |
<p>PURPOSE:To improve the reliability of solder-bonding outer leads by providing an Ni-plating layer on a Cn or Cu alloy blank, and further providing an Ni-P plating layer only on a region except the outer lead part to become an external terminal. CONSTITUTION:An Ni-plating B exists on a copper blank 7 in the metal layer structure of outer leads 3, and a covering layer of PbSn solder 6 is further formed. The Ni-plating 8 is provided on the blank 7 in a semiconductor pellet placing unit, an Ni-P plating layer 9 is further formed, and a semiconductor pellet 4 is brazed by a solder 5 on the layer 9. Accordingly, since the intermetallic compound of the Ni-P and the Sn is not generated, the strong bondability of a solder coating layer is maintained to remarkably improve the reliability of solder-bonding the outer leads.</p> |
