| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of repairing an electronic circuit component whereby the component to be repaired is heated to uniformly melt solder in a short time by suppressing heating nonuniformity of the component and the component can be surely removed in a short time. SOLUTION: The repairing method comprises irradiating an electronic circuit component 4 connected with solder 3 on a board 2 with infrared rays from infrared irradiating means 5 to melt the solder 3, and sucking the electronic circuit component 6 at the top with a negative pressure from a sucking means 7 having a negative pressure source 6 and a suction passage 70 communicating with the pressure source 6, thereby removing the electronic circuit component 4 from the board 2. At least, a part of the suction means 7 involved in the infrared irradiation range of the irradiating means 5 on the electronic circuit component 4 is made of an infrared ray permeable material, thereby irradiating approximately the entire top face of the electronic circuit component 4 with infrared rays.
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