PHOTOSEMICONDUCTOR ELEMENT ARRAY

摘要

PURPOSE:To render a connection more stronger and prevent electrical connections from being cut due to some contact and impulse or thermal fluctuation by causing photosemiconductor elements directly to come into contact with driving ICs and both of them to be electrically connected each other. CONSTITUTION:LED chips 2 are linearly arranged on a substrate 1 and driving ICs are mounted on both sides of the LED chips so that such ICs are adjacent each other to contact directly the LED chips and electrodes 6 and 7 to be connected are installed in a state that they are extended to the surface where both electrodes are in contact with each other. Once the driving IC 3 moves in the direction with a arrow mark to contact the LED array chips, the electrodes 6 and 7 come into contact with each other and then they are electrically connected. Obviously these LED chips and driving ICs are fixed on the substrate 1 but it is preferable for them to be fixed with a conductive adhesive agent.