| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card that can be aligned neatly with other IC cards even when the cards are piled up mountain-high with their surfaces being arranged in the same direction and, in addition, can be transported without trouble. SOLUTION: This IC card uses card substrates composed of a modified polyester resin obtained by polymerizing at least ethylene glycol, terephthalic acid, and 1,4-cyclohexanedimethanol as its surface and rear substrates 41 and 42 and has a warping controlling intermediate layer 43 arranged on the rear surface side of the center line in the thickness direction of the card between the substrates 41 and 42. When the card is put on a pedestal, a gap of 0.05-0.8 mm is recognized between the central part of the card and the flat surface of the pedestal when viewed from the side face of the card in the long-side direction. The card has long sides of 84-86 mm in length and short sides of 53-58 mm in length. Since the IC card always warps in the same direction and the warping amount of the card is controlled, the card can be piled upon another card easily. |
